• JEDEC JEP126
Provide PDF Format

Learn More

JEDEC JEP126

  • GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS
  • standard by JEDEC Solid State Technology Association, 05/01/1996
  • Publisher: JEDEC

$24.00$48.00


This publication provides a guideline to suppliers of IC components with a template for documenting the numerical simulation assumptions. In addition this guideline also suggests a model environment to reference when comparing various packages or component suppliers. This publication should improve the communication between the package model suppliers. This publication should improve the communication between the package model supplier and the end user.

Related Products

JEDEC JESD22-B106D

JEDEC JESD22-B106D

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES..

$27.00 $53.00

JEDEC JESD 320-A (R2002)

JEDEC JESD 320-A (R2002)

CONDITIONS FOR MEASUREMENT OF DIODE STATIC PARAMETERS..

$24.00 $47.00

JEDEC JEP126

JEDEC JEP126

GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYS..

$24.00 $48.00

JEDEC JESD218B

JEDEC JESD218B

SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD..

$38.00 $76.00