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JEDEC JESD22-B118
- SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
- standard by JEDEC Solid State Technology Association, 03/01/2011
- Publisher: JEDEC
$30.00$59.00
This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
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