Provide PDF Format
JEDEC JESD51-4
- THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
- standard by JEDEC Solid State Technology Association, 02/01/1997
- Publisher: JEDEC
$28.00$56.00
This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip design but allows flexibility in the materials and layout requirements.
Related Products
JEDEC JESD22-A100-A
Solid State Devices, Testing Quality and Reliability - Test Method A100: Cycled Temperature Humidity..
$47.00 $93.00
JEDEC JESD51-51
Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impe..
$36.00 $72.00
JEDEC JEP139
GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR ST..
$30.00 $59.00