Provide PDF Format
JEDEC JESD 22-A121A (R2014)
- MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
- standard by JEDEC Solid State Technology Association, 07/01/2008
- Publisher: JEDEC
$37.00$74.00
The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.
Related Products
JEDEC JS709
JOINT JEDEC/ECA STANDARD, DEFINING "LOW-HALOGEN" PASSIVES AND SOLID STATE DEVICES (Removal..
$30.00 $60.00
JEDEC JESD22-A113F
PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING..
$30.00 $59.00
