JEDEC
JEDEC is the global leader in developing open standards for the microelectronics industry. With over 4,000 volunteers representing nearly 300 member companies. JEDEC brings manufacturers and suppliers together on 50 different committees, creating standards to meet the diverse technical and developmental needs of the industry. These collaborations ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs.
Sort By:
Default
Name (A - Z)
Name (Z - A)
Price (Low > High)
Price (High > Low)
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
$34.00 $67.00
Add to Cart
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
$36.00 $72.00
Add to Cart
PRODUCT DISCONTINUANCE
$26.00 $51.00
Add to Cart
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)
$30.00 $60.00
Add to Cart
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)
$30.00 $60.00
Add to Cart
METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
$26.00 $51.00
Add to Cart
INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
$39.00 $78.00
Add to Cart
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
$28.00 $56.00
Add to Cart
TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT
$30.00 $59.00
Add to Cart
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
$31.00 $62.00
Add to Cart
Glossary of Thermal Measurement Terms and Definitions
$27.00 $54.00
Add to Cart
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR)
$31.00 $62.00
Add to Cart
LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
$27.00 $53.00
Add to Cart
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
$30.00 $59.00
Add to Cart
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
$28.00 $56.00
Add to Cart
Showing 301 to 315 of 463 (31 Pages)